离子注入机：ion implanter



LSS理论：Lindhand Scharff and Schiott theory，又称“林汉德-斯卡夫-斯高特理论”。



沟道效应：channeling effect



射程分布：range distribution



深度分布：depth distribution



投影射程：projected range



阻止距离：stopping distance



阻止本领：stopping power



标准阻止截面：standard stopping cross section



退火：annealing



激活能：activation energy



等温退火：isothermal annealing



激光退火：laser annealing



应力感生缺陷：stress-induced defect



择优取向：preferred orientation



制版工艺：mask-making technology



图形畸变：pattern distortion



初缩：first minification



精缩：final minification



母版：master mask



铬版：chromium plate



干版：dry plate



乳胶版：emulsion plate



透明版：see-through plate



高分辨率版：high resolution plate, HRP



超微粒干版：plate for
ultra-microminiaturization



掩模：mask



掩模对准：mask alignment



对准精度：alignment precision



光刻胶：photoresist，又称“光致抗蚀剂”。



负性光刻胶：negative photoresist



正性光刻胶：positive photoresist



无机光刻胶：inorganic resist



多层光刻胶：multilevel resist



电子束光刻胶：electron beam resist



X射线光刻胶：X-ray resist



刷洗：scrubbing



甩胶：spinning



涂胶：photoresist coating



后烘：postbaking



光刻：photolithography



X射线光刻：X-ray lithography



电子束光刻：electron beam lithography



离子束光刻：ion beam lithography



深紫外光刻：deep-UV lithography



光刻机：mask aligner



投影光刻机：projection mask aligner



曝光：exposure



接触式曝光法：contact exposure method



接近式曝光法：proximity exposure method



光学投影曝光法：optical projection exposure method



电子束曝光系统：electron beam exposure system



分步重复系统：step-and-repeat system



显影：development



线宽：linewidth



去胶：stripping of photoresist



氧化去胶：removing of photoresist by oxidation



等离子［体］去胶：removing of photoresist by plasma



刻蚀：etching



干法刻蚀：dry etching



反应离子刻蚀：reactive ion etching,：RIE



各向同性刻蚀：isotropic etching



各向异性刻蚀：anisotropic etching



反应溅射刻蚀：reactive sputter etching



离子铣：ion beam milling，又称“离子磨削”。



等离子［体］刻蚀：plasma etching



钻蚀：undercutting



剥离技术：lift-off technology，又称“浮脱工艺”。



终点监测：endpoint monitoring



金属化：metallization



互连：interconnection



多层金属化：multilevel metallization



电迁徙：electromigration



回流：reflow



磷硅玻璃：phosphorosilicate glass



硼磷硅玻璃：boron-phosphorosilicate glass



钝化工艺：passivation technology



多层介质钝化：multilayer dielectric passivation



划片：scribing



电子束切片：electron beam slicing



烧结：sintering



印压：indentation



热压焊：thermocompression bonding



热超声焊：thermosonic bonding



冷焊：cold welding



点焊：spot welding



球焊：ball bonding



楔焊：wedge bonding



内引线焊接：inner lead bonding



外引线焊接：outer lead bonding



梁式引线：beam lead



装架工艺：mounting technology



附着：adhesion



封装：packaging



金属封装：metallic packaging



陶瓷封装：ceramic packaging



扁平封装：flat packaging



塑封：plastic package



玻璃封装：glass packaging



微封装：micropackaging，又称“微组装”。



管壳：package



管芯：die



引线键合：lead bonding



引线框式键合：lead frame bonding



带式自动键合：tape automated bonding, TAB



激光键合：laser bonding



超声键合：ultrasonic bonding



红外键合：infrared bonding

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